Kinetics Study of Copper (II) Adsorption from Solution by Wheat Husk

Abstract:

The effect of initial copper concentration, particle diameter of wheat husk and the determination of the kinetic parameters of copper ion adsorption onto wheat husk were performed to understand the adsorption mechanism. The pseudo-second order kinetic model was fitted to the experimental data and found it was good to predict the adsorption behavior using nonlinear regressive method, suggesting that the mechanism may be a chemisorption process. The diffusion coefficient was also estimated and the pore diffusion was not significant.

• Periodical: Advanced Materials Research (Volumes 391-392)
• Pages: 404-408
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.391-392.404
• Online since: December 2011
• Authors: Dan Ma, Xiu Rong Zhao, Zhi Qiang Wang, Ya Li Liu, Run Ping Han
• Keywords: Adsorption, Copper Ion, Kinetic, Wheat Husk

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