Effects of Preparation Technology on the Microstructure and Thermal Conductivity of Cu-11Ni-2W Alloy

Abstract:

Cu-11Ni-2W alloys have been prepared by vacuum non-consumable arc-melting and high-frequency induction melting injection moulding. The effects of melting processes on the resultant microstructure were studied. The results show that the grain of Cu-11Ni-2W alloy prepared by vacuum non-consumable arc-melting is coarse and the microstructure includes α solid solution and W particles. As for the sample prepared by high-frequency induction melting injection moulding, the grain is superfine and the microstructure is α solid solution. Moreover, the thermal conductivity coefficient for the sample prepared by vacuum non-consumable arc-melting is 67.2 W/(m•K), while that for high-frequency induction melting injection moulding is 47.8 W/(m•K). The melting point of Cu-11Ni-2W alloy prepared by vacuum non-consumable arc-melting is 1157.27°C.

• Periodical: Advanced Materials Research (Volumes 396-398)
• Pages: 508-511
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.396-398.508
• Online since: November 2011
• Authors: Bai Ping Lu, Can Cheng Liu, Hui Xu
• Keywords: Cu-11Ni-2W Alloy, High-Frequency Induction Melting Injection Moulding, Thermal Conductivity (TC), Vacuum Non-Consumable Arc-Melting

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