A Theoretical and Experimental Study on Temperature Dependent Characteristics of Silicon MEMS Gyroscope Drive Mode

Article Preview

Abstract:

The prototype of the silicon micro gyroscope is introduced. Temperature is the key factor that affects the performance of the gyroscope. In this paper, temperature dependent characteristics of silicon micro gyroscope drive mode is analyzed. The theoretical results show that temperature coefficient of the Young’s modulus is the most critical factor that affects temperature characteristics of the silicon micro gyroscope’s drive modal frequency and the frequency is proportional to the temperature. The results are verified by finite element simulations. The silicon micro gyroscopes are experimented in a high accurate thermostat. The drive modal frequency and temperature are measured and sampled. These experimental results show that the temperature coefficient of Young’s modulus is the key factor and the frequency is proportional to the temperature. The theoretic analyses are also validated by the experiments.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 403-408)

Pages:

4237-4243

Citation:

Online since:

November 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] P. Greiff, B. Boxenhorn, T. King, L. Niles, Silicon monolithic micromechanical gyroscope, 1991 International Conference on Solid-State Sensors and Actuators, Digest of Technical Papers, pp.966-968, (1991).

DOI: 10.1109/sensor.1991.149051

Google Scholar

[2] N. Yazdi, F. Aayzi, K. Najafi, Micromachined Inertial Sensors, Proceedings of the IEEE, vol. 86, no. 8, pp.1640-1659, Aug (1998).

DOI: 10.1109/5.704269

Google Scholar

[3] K. Shcheglov, C. Evans, R. Gutierrez, T.K. Tang, Temperature dependent characteristics of the JPL silicon MEMS gyroscope, 2000 IEEE Aerospace Conference Proceedings, vol. 1, pp.403-411, (2000).

DOI: 10.1109/aero.2000.879420

Google Scholar

[4] M.I. Ferquson, D. Keymeulen, C. Peay, K. Yee, D.L. Li, Effect of temperature on MEMS vibratory rate gyroscope, 2005 IEEE Aerospace Conference, Big Sky, MT, United states, March 2005, doi: 10. 1109/AERO. 2005. 1559561.

DOI: 10.1109/aero.2005.1559561

Google Scholar

[5] A.A. Trusov, A.R. Schofield, A.M. Shkel, Performance characterization of a new temperature-robust gain-bandwidth improved MEMS gyroscope operated in air, Sensors and Actuators: A Physical, vol. 155, no. 1, pp.16-22, Oct (2009).

DOI: 10.1016/j.sna.2008.11.003

Google Scholar

[6] G.J. Liu, A.L. Wang, T. Jiang, J.W. Jiao, J. -B. Jang, Effects of environmental temperature on the performance of a micromachined gyroscope, Microsystem Technologies, vol. 14, no. 2, pp.199-204, Feb (2008).

DOI: 10.1007/s00542-007-0411-4

Google Scholar

[7] B. Zhou, R. Zhang, Zh.Y. Chen, Online self-compensation for enhanced the scale factor stability of a micromachined gyroscope, Journal of Physics: Conference Series, vol. 188, no. 1, p.012043, (2009).

DOI: 10.1088/1742-6596/188/1/012043

Google Scholar

[8] C.C. Painter, A.M. Shkel, Structural and thermal modeling of a z-axis rate integrating gyroscope, Journal of Micromechanics and Microengineering, vol. 13, no. 2, pp.229-237, March (2003).

DOI: 10.1088/0960-1317/13/2/310

Google Scholar

[9] Q. Shi, R. Zh. Ding, Y. Su, A.P. Qiu, Device-level vacuum packaging of silicon microgyroscopes, Journal of Mechanical Engineering, vol. 45, no. 2, pp.243-246, Feb 2009, (in Chinese).

DOI: 10.3901/jme.2009.02.243

Google Scholar

[10] R.T. M'Closkey, A. Vakakis, Analysis of a Microsensor Automatic Gain Control Loop, Proceedings of the 1999 American Control Conference, vol. 5, pp.3307-3311, (2009).

Google Scholar

[11] C.T. -C. Nguyen, R.T. Howe, An integrated CMOS micromechanical resonator high-Q oscillator, IEEE Journal of Solid-State Circuits, vol. 34, no. 4, pp.440-455, April (1999).

DOI: 10.1109/4.753677

Google Scholar

[12] C. -K. T. William, Electrostaic comb drive for resonant sensor and actuator application, University of California, Berkeley, (1990).

Google Scholar

[13] J. Qian, CH. Liu, D. CH. Zhang, Residual stresses in micro-electro-mechanical systems, Journal of Mechanical Strength, vol. 23, no. 4, pp.393-401, 2001, (in Chinese).

Google Scholar

[14] Y. Okada, Y. Tokumaru, Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 and 1500K, Journal of Applied Physics, vol. 56, no. 2, pp.314-320, July1984.

DOI: 10.1063/1.333965

Google Scholar