Study on Cavitation Mechanism of Pulse Electrochemical Compound Machining

Abstract:

According to this theory, the cavitation mechanism of ultrasonic-pulse electrochemical compound machining (UPECM) based on particle impact is proposed in the paper. The mechanism was studied particularly, and validated by experiments. The results show that ultrasonic cavitation promote pulse electrochemical compound machining, and particle impact has the catalysis of the anodic dissolution in the ultrasonic-pulse electrochemical compound machining. The results also indicate that the processing velocity can be improved under the particle impact, obtaining the surface quality in UPECM compound machining.

• Periodical: Advanced Materials Research (Volumes 418-420)
• Pages: 2139-2142
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.418-420.2139
• Online since: December 2011
• Authors: Cheng Guang Zhang, Fei Hu Zhang, Cheng Guang Zhang
• Keywords: Cavitation Mechanism, Particle Impact, Pulse Electrochemical Machining(PECM)

References

[1] C G Zhang, C S Liu. Research of mechanism for ultrasonic and electrochemical Abrasive machining [J].Coal Mine Machinery, 2006, 27(8):84-85.

[2] J Kozak ,K P Rajurkar and B Wei. Modeling and analysis of pulse electrochemical machining[J]. Transactions of the ASME-Journal of Engineering for Industry,1994,116(3):316-323.

DOI: 10.1115/1.2901947

[3] J An, X M Wang, H Y Li. Research on factors affecting machining quality of pulse electrochemical polishing [J]. Manufacturing Technology & Machine Tool, 2001,50(5): 32-34.

[4] J. Kozak and K. P. Rajurkar. Selected problems of micro electrochemical machining. Journal of Materials Processing Technology, 149(1-3), 426-431 (2004).

DOI: 10.1016/j.jmatprotec.2004.02.031

[5] Y Zhou, D P Liang. Study on the Theoretic Model of Ultrasonic Polishing [J]. China Mechanical Engineering, 2005,16 (8) :664-666.

[6] J S Tang, J G Du, C G Zhang. Research on Mechanism for Ultrasonic-PECM Abrasive Machining [J]. Joural of Wuhan University of Technology, 2008 30(1):140-143.

[7] Ohmori H, et al. Efficient and precision grinding of small hard and brittle cylindrical parts by the centerless grinding process combined with electro-discharge truing and electrolytic in-process dressing[J]. Journal of Materials Processing Technology, 2000, 98(3): 322-327.

DOI: 10.1016/s0924-0136(99)00348-9

[8] Chu Xiangfeng, Bai linshan, et al. electrochemical machine polishing of copper in the ULSI[J]. Microelectron, 2009, 46(2):115-118.

[9] Liu JH, Pei Z J, Graham R Fisher. ELID grinding of silicon wafers: A literature review[J]. International Journal of Machine Tools and Manufacture, 2007, 47(3-4): 529-536.

DOI: 10.1016/j.ijmachtools.2006.06.001

[10] Bandyopadhyay B P, H Ohmori. The effect of ELID grinding on the flexural strength of silicon nitride[J]. International Journal of Machine Tools and Manufacture, 1999, 39(5):839-853.

DOI: 10.1016/s0890-6955(98)00038-8