Surface Residual Stress Analysis Based on the Molecular Dynamics on Micro/Nano Scale

Zhu Ying; L. Zhou; D.Y. Gao

doi:10.4028/www.scientific.net/AMR.426.325

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 426Surface Residual Stress Analysis Based on the...

Surface Residual Stress Analysis Based on the Molecular Dynamics on Micro/Nano Scale

Abstract:

The molecular dynamics simulation and experimental study of residual stress were carried out on micro/nano scale. The relationship between residual stress and hardness was researched by the simulation for nano-indentation process of single crystal cooper. It was showed that load-displacement curve above reference state when single crystal copper surface exists compressive residual stress,and the existence of tensile residual stress is below reference state. Then the phenomenon was analyzed and gave a reasonable explanation. In addition, the regression analysis of relationship between micro/nano-hardness and residual stress was carried out.

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Periodical:

Advanced Materials Research (Volume 426)

Pages:

325-329

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.426.325

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Online since:

January 2012

Authors:

Zhu Ying, L. Zhou, D.Y. Gao

Keywords:

Molecular Dynamic (MD), Residual Stress, Single Crystal Cooper

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References

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DOI: 10.1557/s088376940004714x

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