Study on Curing Kinetics of a Novel Epoxy Resin System for Hot-Melt Prepreg

Quan Zhou  Li; Xiao Qing Wu

doi:10.4028/www.scientific.net/AMR.457-458.453

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Design and Assessment of a Flexure-Based 2-DOF Micromanipulator for Automatic Cell Micro-Injection
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Numerical Analysis of the GF/UHMWPEF Interply Hybrid NOL Ring Critical Volume Fraction
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Study on Curing Kinetics of a Novel Epoxy Resin System for Hot-Melt Prepreg
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Isolation and Identification of a Chitin Degrading Bacterium Aeromonas SP D5-23 and Properties of Chitinase
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 457-458Study on Curing Kinetics of a Novel Epoxy Resin...

Study on Curing Kinetics of a Novel Epoxy Resin System for Hot-Melt Prepreg

Abstract:

The curing kinetics of the novel epoxy system for hot-melt prepreg was investigated using nonisothermal differential scanning calorimetry (DSC), and determined by Kissinger, Ozawa and Crane methods in this paper. The results showed that the value of Ti, Tp, and Tf were 446.5K, 454.7K, 491.4K, respectively. Furthermore the value of Ea1 and Ea2 determined by Kissinger and Ozawa method, respectively, were approximate, and the mean value of activation energy (Ea) is 139.31 KJ/mol. The value 0.9488 of curing reaction order n indicated that the curing reaction was complex reaction.