Electrochemical Study of the Additive-Effect on Sn Electrodeposition in a Methansulfonate Acid Electrolyte

Jin Ming Long; Zhu Zhang; Zhong Cheng Guo; Xiao Yun Zhu; Hui Huang

doi:10.4028/www.scientific.net/AMR.460.7

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Electrochemical Study of the Additive-Effect on Sn Electrodeposition in a Methansulfonate Acid Electrolyte
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 460Electrochemical Study of the Additive-Effect on Sn...

Electrochemical Study of the Additive-Effect on Sn Electrodeposition in a Methansulfonate Acid Electrolyte

Abstract:

The effect of three organic additives in stannous methanesulfonate baths on cathodic overpotential and Faradaic impedance of tin-electrodeposition were studied by measuring cathodic polarization curves, galvanostatic responses and electrochemical impedance spectroscopy. The results show that the composite additive consisting of three organic compounds can significantly increase the cathodic polarization, crystallization overpotential and charge transfer resistance, which is very beneficial to improve coating quality and result in a fine-grained and smooth matt tin coating.

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Periodical:

Advanced Materials Research (Volume 460)

Pages:

7-10

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.460.7

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Online since:

February 2012

Authors:

Jin Ming Long, Zhu Zhang, Zhong Cheng Guo, Xiao Yun Zhu, Hui Huang

Keywords:

Additive, EIS, Overpotential, Stannous Methanesulfonate, Tin Plating

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References

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