Design of 2-DOF Precision Positioning Table for IC Packaging

Xiao Mei Feng; Li Shun Li; Da Wei Zhang; Wen Kai Liu

doi:10.4028/www.scientific.net/AMR.466-467.956

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 466-467Design of 2-DOF Precision Positioning Table for IC...

Design of 2-DOF Precision Positioning Table for IC Packaging

Abstract:

A VCA direct-drive 2-DOF precision positioning table is put forward, which can be applied to IC packaging for wafer wire bonding equipment. With the help of a novel elastic decoupling mechanism, the VCA is mounted on the baseboard, diminishing its moving inertia, improving its dynamic performance. The table structural is detailed and its dynamic design approach is proposed. The prototype experiment shows that the new 2-DOF positioning table is of higher speed and higher accuracy than the traditional ones.

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Periodical:

Advanced Materials Research (Volumes 466-467)

Pages:

956-960

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.466-467.956

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Online since:

February 2012

Authors:

Xiao Mei Feng, Li Shun Li, Da Wei Zhang, Wen Kai Liu

Keywords:

Decoupling Mechanism, Performance Experimentation, VCA, XY Table

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