Ultrasound Multipath Signature of Material Flaw Depth with Single Mono/bi-Static Measurement

Xi Zhong Shen; Kui Yuan

doi:10.4028/www.scientific.net/AMR.468-471.1199

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 468-471Ultrasound Multipath Signature of Material Flaw...

Ultrasound Multipath Signature of Material Flaw Depth with Single Mono/bi-Static Measurement

Abstract:

Ultrasonic signature of flaw is studied in the multipath scene, and a method is developed to localize the flaw by only single mono/bi-static measurement. A signal model based on the concept of multipath is built to construct flaw position, of which multipath scenarios are reviewed for signature of flaw depth. Multipath scenarios may be identified by direct path, which is relatively easy to be detected. Algebraic solution is proposed to solve the multipath equations to obtain the position of the flaw depth. Experiments show that the solution of the flaw depth is valid.

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Periodical:

Advanced Materials Research (Volumes 468-471)

Pages:

1199-1202

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.468-471.1199

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Online since:

February 2012

Authors:

Xi Zhong Shen, Kui Yuan

Keywords:

Flaw, Multipath, Signal Model, Signature, Ultrasound (US)

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References

[1] L. W. Schmerr and S.-J. Song, "Ultrasonic Nondestructive Evaluation Systems", Springer, 2007.

Google Scholar

[2] R. Lasser, M. Lasser, J. Kula, D. Eich, and R. Westernik, "Remote, simple nondestructive testing of composite defects with An ultrasound camera: a Boeing study," in Proc. Composites, Las Vegas, NV, Feb. 2010.

Google Scholar

[3] Xizhong Shen, Yimin D. Zhang, R. Demieli, and M. G. Amin, "Ultrasonic Flaw Imaging Exploiting Multipath Information". SPIE 2011.

Google Scholar

[4] F. Ahmad, and M. G. Amin, "Noncoherent approach to through-the-wall radar localization", IEEE transactions on aerospace and electronic system, vol. 42, No. 4, 2006, pp: 1405-1419.

DOI: 10.1109/taes.2006.314581

Google Scholar

[5] Olympus NDT, "5072PR, 5073PR, 5077PR Manually Controlled Pulser-Receivers." Available at http://www.olympus-ims.com/en/5072pr/.

Google Scholar

[6] Olympus NDT contact transducers. Available at http://www.olympus-ims.com/en/ panametrics-ndt-ultrasonic/ contact-transducers/.

Google Scholar