The Discontinuous Higher Order Fields for Anti-Plane Crack at Interface

Yao Dai; Shi Min Li; Wei Tan

doi:10.4028/www.scientific.net/AMR.47-50.1027

Paper Titles

Layer-by-Layer Finite Element Analysis of Smart Composite Plates
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Cuprous Oxide Films Prepared by Using a Microwave Atmospheric Pressure Plasma Torch
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Composites of Pet and PBT/PP with Bentonite
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Analytical Solutions for Crack-Tip Higher Order Stress Fields in Thermal Barrier Coating
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The Discontinuous Higher Order Fields for Anti-Plane Crack at Interface
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Effect of Electrospun Fibers on the Interlaminar Properties of Woven Composites
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Functionally Graded Dental Implant and its Effect on Bone Remodeling
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A Study on Improvement Capture Velocity for Increasing Inhalation Efficiency of Hood in Local Ventilation System
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Study on Three-Dimensional Thermal Deformation of Aluminum Casting Tire Mold by Numerical Analysis and Experiment
p.1043

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 47-50The Discontinuous Higher Order Fields for...

The Discontinuous Higher Order Fields for Anti-Plane Crack at Interface

Abstract:

The high order discontinuous asymptotic fields similar to the Williams’ solutions to crack problems in homogeneous materials are obtained by asymptotic analysis for an anti-plane problem in non-homogeneous materials and the crack at the physical weak-discontinuous interface. These results provide a theoretical basis for engineering application of weak-discontinuity fracture.