Pseudoelastic Behavior of Cu–Al–Be Shape Memory Wires Subjected to Varied Loading and Unloading Cycles

Sheng Lu; Jing Chen; Liu Qiao Chen

doi:10.4028/www.scientific.net/AMR.47-50.886

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Pseudoelastic Behavior of Cu–Al–Be Shape Memory Wires Subjected to Varied Loading and Unloading Cycles
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Pseudoelastic Behavior of Cu–Al–Be Shape Memory Wires Subjected to Varied Loading and Unloading Cycles

Abstract:

Cyclic loading and unloading tensile tests were carried out for Cu-11.30wt. %Al-0.32wt. % Be Shape Memory Alloys (SMA) wires to investigate the effect of temperature and cyclic condition on the pseudoelastic behavior. It is shown that σc increases with the isothermal external temperature in single cycle tests and loading stress in constant stress increment tests while tends to a stable level after the 1st cycle in constant maximum strain tests. Both modes of loading and unloading improve the pseudoelasticity obviously.