Numerical Analysis of Thermally-Induced Residual Stresses in Beryllium Caused by BeO

Jing Mao; Li Jun He; De Mei Xu

doi:10.4028/www.scientific.net/AMR.476-478.2510

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 476-478Numerical Analysis of Thermally-Induced Residual...

Numerical Analysis of Thermally-Induced Residual Stresses in Beryllium Caused by BeO

Abstract:

A numerical analysis was performed to investigate the thermally-induced residual stress caused by the thermal expansion mismatch between Be and BeO. Models were constructed according to the real situation that the BeO particles embedded in grains or distributed at the grain boundaries, where the temperature-dependent materials properties, particle volume fraction and size and interparticle distance were taken into account. In simulation, it supposes particles inside grain no interacting with others, particles along the grain boundary being a period distribution. Be is modeled as elastic and elastic-plastic material with bilinear kinematic hardening model. BeO is modeled as isotropic and linear elastic. All simulations are performed by using ANSYS finite element code. Results show that the size, location and the volume fraction of particles influence on the residual stress (strain) to different extent during cooling process.

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Periodical:

Advanced Materials Research (Volumes 476-478)

Pages:

2510-2514

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.476-478.2510

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Online since:

February 2012

Authors:

Jing Mao, Li Jun He, De Mei Xu

Keywords:

Be, Finite Element Method (FEM), Residual Stress, Thermal Mismatch

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