Effect of Rare Earths Addition on Mechanical Properties and Wetting Behavior of Sn-2.5Ag-0.7Cu Lead-Free Solder

Abstract:

In the present study, the Effect of rare earths on mechanical properties and wetting behavior of Sn-2.5Ag-0.7Cu solder were investigated. Results indicate that the addition of trace rare earths can improve the properties of Sn-Ag-Cu lead-free solder. The elongation and tensile strength and wetting force of solder can reach the optimal values when rare addition is 0.1wt.%. But excessive rare earths can lead to performance decline. The properties change of the Sn-2.5Ag-0.7Cu solder are attributed to the change of the microstructure caused by trace rare earths additions.

• Periodical: Advanced Materials Research (Volumes 490-495)
• Pages: 3119-3123
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.490-495.3119
• Online since: March 2012
• Authors: Jie Yang, Ping Sheng Shu, Xiao Le Feng, Xiu Yun Hao, Yu Peng Wang
• Keywords: Mechanical Property, Rare Earth (RE), Sn-Ag-Cu Lead-Free Solder, Wetting Property

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