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Fabrication of C/Cu Composites by Mechanical Activation and Spark Plasma Sintering
Abstract:
C/Cu self-lubricating composites were a kind of potentially functional materials. Nanostructured C/Cu composites were prepared by the new technology of mechanical activation-spark plasma sintering (MA-SPS). Microstructures of the as-milled powder and the as-sintered simple were characterized by transmission electron microscopy (TEM) and X-ray diffraction (XRD), respectively. These investigations indicated that in Cu-C immiscible system, the nanostructured supersaturated solid solution of carbon in copper was formed at atomic level after milling for 24 h. Microstructures of SPS sintered C/Cu composites still kept the nanostructure. In addition, Cu-C interface bonding was good. It was ascribed to a double activation mechanism in the MA-SPS process, which improved the sintering activity of C/Cu powders. Nanostructured C/Cu composites were obtained by SPS sintered at 600 °C for 3 min.
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223-226
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April 2012
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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