For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Two-Photon Three-Dimensional Optical Storage of a New Photobleaching Material
p.8
Kinetics of Thermal Oxidation of TA2
p.12
Experimental Study of Squeeze Casting of AZ31 Magnesium Alloy
p.16
Modified N Doped TiO2 Nanotubes with Magnetic γ-Fe2O3 as Visible Light Photocatalysts
p.20
Effect of Diamond on the Thermal Conductivities of Diamond-Copper Composites Prepared by Spark Plasma Sintering
p.25
Polyamide 6/Polyurethane/Graphite Composites Prepared by Anionic Polymerization Process. II. Friction and Wear
p.30
Investigation on Preparation and Electrical Properties of Novel Perovskite Cathode Materials Doped with Multi-Elements for IT-SOFC
p.35
Polyamide 6/Polyurethane/Graphite Composites Prepared by Anionic Polymerization Process. I. Mechanical Properties
p.40
Study of Detecting Flaws in a Heavy Bridge-Making Steel Plate
p.45

Effect of Diamond on the Thermal Conductivities of Diamond-Copper Composites Prepared by Spark Plasma Sintering

Article Preview

Abstract:

Diamond-copper composites are fabricated by spark plasma sintering (SPS). The effects of particle size, original properties and coatings of diamond on the thermal conductivity (TC) of diamond-copper composites have been investigated, respectively. The results indicate that thermal conductivity of composites enhances with an increase in particle size and original properties of diamond. Composites with Cr, Ti or Ni coatings on diamond surface appear remarkably higher TC than that which without any coatings. The improvements of TC of diamond/copper composites are mainly due to the large particle size diamond decreasing the interfacial area in composites, the high original properties diamond possessing higher original TC, and coatings on diamond surface declining the interfacial thermal resistance and improving the wetting properties between diamond and copper.

You might also be interested in these eBooks
Materials Science and Information Technology II View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 532-533)

Pages:

25-29

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.532-533.25

Citation:

Cite this paper

Online since:

June 2012

Authors:

Ying Hu Dong, Rui Qing Zhang, Zhi Guo Ye

Keywords:

Composite, Spark Plasma Sintering (SPS), Thermal Property

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] C. Zweben: Power Electron Technol Vol. 3(2006), p.240.

Google Scholar

[2] S. Dave: Adv Microelectron Vol. 11-12(2004), p.6.

Google Scholar

[3] N. Govindaraju, R.N. Singh: Comput Mater Sci Vol. 43(2008), p.423.

Google Scholar

[4] S. Ahmed, R. Liske, T. Wunderer, et al. Diamond Relat Mater Vol. 15 (2006), p.389.

Google Scholar

[5] C. Gu, Z. Jin, X. Lu, et al. Thin Solid Films Vol. 311(1997), p.124.

Google Scholar

[6] K.J. Gray: Diamond Relat Mater Vol. 9 (2000), p.201.

Google Scholar

[7] K.M. Leung, A.C. Cheung, B.C. Liu, et al. Diamond Relat Mater Vol. 8 (1999), p.1607.

Google Scholar

[8] D.V. Fedoseev, V.L. Buhovets, S.P. Vnukov: Surface Vol. 1 (1980), p.92.

Google Scholar

[9] E.A. Ekimov, N.V. Suetin, et al. Diamond Relat Mater Vol. 17(2008), p.838.

Google Scholar

[10] K. Yoshida, H. Morigami: Microelectron Reliab Vol. 44(2004), p.303.

Google Scholar

[11] M.G. de Azevedo, A. Potemkin, A.L.D. Skury: Diamond Relat Mater Vol. 10(2001), p.1607.

Google Scholar

[12] L. Weber, R. Tavangar: Scripta Mater Vol. 57(2007), p.988.

Google Scholar

[13] Th. Schubert, B. Trindade, et al. Mater Sci Eng A Vol. 475 (2008), p.39.

Google Scholar

[14] T. Schubert, Ł. Ciupiński, W. Zieliński, et al. Scripta Mater Vol. 58 (2008), p.263.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.