Study on Present Situation and New Trends of the Electrodeposition of Nickel-Cobalt Alloy

Abstract:

Nickel-cobalt alloys have broad application prospect for their excellent properties (i.e. high microhardness, strength, abrasion, corrosion resistance and magnetic properties.etc). Present situation and new trends on mechanism of the anomalous codeposition and technology of electrodepostion of nickel-cobalt were studied. Effects of electrolysis parameters (e.g. concentration of co2+in the electrolyte, cathodic current density, pH value, temperature.etc) on the alloy composition, morphology and mechanical properties were analyzed. The formation of the monovalent intermediate (hydroxides or colloid) may cause the cobalt preferential deposition or the faster charge-transfer of Co2+ reduction compared to that of Ni2+ reduction is the main factor that causes the anomalous codeposition behavior of the nickel-cobalt alloy.

• Periodical: Advanced Materials Research (Volumes 535-537)
• Pages: 973-976
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.535-537.973
• Online since: June 2012
• Authors: Ming Ming Yu, Hong You Li, Yi Wang
• Keywords: Codeposition Mechanism, Mechanical Property, Ni-Co Alloy, Technological Parameter

References

[1] Zhen-mi Tu, Theo. and tech. of electroplating alloy [A].China National Defe. Industry Press.(1995)

[2] Ali Karpuza, Hakan Kockara, Mursel Alperb, et al. Applied Surface Sci.258 (2012) 4005-4010.

[3] C. Lupia, A. Dell'Erab, M. Pasqualic et al. Surface &Coatings Technology (2011)205:5394-5399.

[4] C.K. Chung, W.T. Chang, M.W.liao. Thin Solid Films 519(2011)2075-2078.

[5] O.Ergeneman, K.M. Sivaraman, S.Pane et al. Electrochimica Acta 56(2011)1399-1408.

[6] D.Gangasingh, J.B. Talbot. J. Electrochem. Soc. 138.3605(1991)

[7] Y.Zhuang. E.J. Podlaha. Journal of the Electrochemical Society.147 (6)2231-2236(2000)

[8] N.Zech, E.J. Podlaha, D.Landolt.Journal of the Electrochemical Society. 146(8)2892-2900(1999)

[9] Jorge Vazquez-Arenas, Mark Pritzker. Electrochimica Acta 66(2012)139-150.

[10] Gang Wu, et al. J. of Chem. Engin. of China Universities. Vol.19(2005)48-53.In Chinese.

[11] Wolfgang E.G. Hansal, Barbara Tury, Martina H. Electrochimica Acta 52(2006)1145-1151.

[12] A.H.Du, J.M. Long, H.Z. Pei et al. Electroforming & Finishing.27 (2008):15-17.In Chinese.

[13] M.Srivastava, V.Ezhil Selvi V.K. William.et al. Surface & Coatings Tech.201(2006)3051- 3060.

DOI: 10.1016/j.surfcoat.2006.06.017

[14] C.K. Chung, R.X. Zhou, W.T. Chang. Microsystem Technology (2008) 14:1279-1284.

[15] D.F. Yang, H.Z.P., GuoL.Z. et.al. Electroplating & Pollut. Control.vol.30:5-7.(2010).In Chinese.

[16] L.P. Wang Yan Gao, T. Xua, et al. Materials Chem. and Physics99 (2006)96-103.In Chinese.

[17] G.D. Hibbard, K.T. Aust, U.Erb. Materials Sci. and Engin.A433 (2006)195-202

[18] K.C. Zhou, Li Ma, Z.Y.Li. Trans. of Nonferrous Metals Society of China 2011(21):1052-1060.

[19] Liangliang Tian, Jincheng Xu, Songtao Xiao. Applied Surface Science257 (2011)4689-4694.