Microstructures and Tensile Properties of Electrodeposited Cu Sheets with Grain Sizes from Nanocrystalline to Ultrafine Scale

Han Zhuo Zhang; Huiping Zhang; Lei Liu

doi:10.4028/www.scientific.net/AMR.538-541.1611

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Microstructures and Tensile Properties of Electrodeposited Cu Sheets with Grain Sizes from Nanocrystalline to Ultrafine Scale

Abstract:

Four types of Cu sheets, with average grain sizes of 200 nm, 90 nm, 33 nm and 11 nm respectively, were electrodeposited and tested by tension at both high and low strain rate. Typically, a higher strength with lower tensile ductility was obtained by increasing the strain rate or reducing the grain size till 33 nm. An inverse Hall-Petch result was found in 11 nm Cu, while 200 nm Cu exhibited an increase of both strength and plastic strain by the increment of strain rate. Tensile deformation mechanisms of the Cu sheets were also discussed with their microstructural features.