Research of Thermal Shock Resistance of Si3N4 and SiC

Article Preview

Abstract:

The study is carried out combing with the production practice in Danjiangkou Hongyuan SiC limited. Si3N4 and SiC were prepared successfully from SiC and Silicon power in nitrogen atmosphere at 1425°C and 1375°C sintering temperature by the serial of techniques, such as ingredients, mixing, molding and drying, respectively. In the actual production, silicon powder content and sintering temperature will directly influence the products of the bending strength and thermal shock resistance. By measuring bending strength, porosities, bulk density, XRD and FESEM, the bending strength and thermal shock resistance of samples were studied mainly by changing sintering temperature and silicon powder content. The results show that bending strength and thermal shock resistance of sample which was added 16% Si powder is best. And bending strength and thermal shock resistance of sample of 1425°C sintering temperature is higher than that of 1375°C sintering temperature.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

691-694

Citation:

Online since:

July 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Jian cao. Ceramics. Vol. 4 (2008), p.34.

Google Scholar

[2] G Ziegler. Mater. Sci. Vol. 22 (1987), p.3041.

Google Scholar

[3] M. Lattemann, S. Ulrich. Surf. Coat. Technol. Vol. 201 (2007), p.5564.

Google Scholar

[4] A. P. Prskalo, S. Schmauder, C. Ziebert, etc. Surf. Coat. Technol. Vol. 204 (2010), p. (2081).

Google Scholar

[5] F. Zhang, C. -X. Qi, S. Wang, etc. Solid State Sci. Vol. 13 (2011), p.929.

Google Scholar