“Au (lll)—Cysteine” Complex and its Application in Electro-Less Deposition

Abstract:

Auric-cysteine complex[MAu(Cys)₄.xH₂O,M=K,NH₄,Na] was reported in this paper ,and its application in the electro-less plating was studied . By using single factor’s experiments the optimal plating index has been gotten and they are: pH=7~9,[Au]=1.5~3.5 g/L , temperature 40~60 Ċ, supporting ligand 0.1~0.15M and plating time 6~8minutes respectively. Related quality inspection of the plated panels show that the appearance, adhesion power and gold thickness can meet the standard of the modern industry .

• Periodical: Advanced Materials Research (Volumes 550-553)
• Pages: 1991-1994
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.550-553.1991
• Online since: July 2012
• Authors: Wen Tao Jin, Le Li, De Liang Li, Neng Qing Feng, Ke Lin Li, Jie Luo, Di Yuan Zhong
• Keywords: Auric-Cysteine Complex, Electro-Less Plating

References

[1] K.Harry, U.S. Patent 5,338,343 (1994).

[2] S.Masaki, U.S. Patent.7,264,848(2007).

[3] A.Miwa , Non-cyanogen type electrolytic solution. U.S. Patent.7,261,803(2007).

[4] D.L.L, Trans. Nonfer. Met.Soc.China, Vol.10 (2000), p.250.

[5] D.L.L, CN.Patent 187,543A (1997)

[6] F.Mohr, Gold Bull., Vol.39 (2006),p.212.

[7] H.Schmidbaur., Gold Bull., Vol.37 (2004), p.136.

[8] J.Vicente, Gold Bull. Vol.31 (1998), p.83.

[9] Y.Okinaka, Gold Bull., Vol.37 (2004), p.37.

[10] D.L.L, CN.Patent201210038125.4(2012)

[11] D.L.L, CN. Patent 101724872A(2008)