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Synthesis of Silver Cross-Linked Polyurethane Resin Catalyst and its Application for Electroless Copper Deposition

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Abstract:

A polyurethane resin catalyst with the cross-linking silver (Ag) ion is successfully synthesized in this study, and its use as a catalyst in electroless copper deposition is also analyzed. FT-IR, SEM, EDX and electrochemical open circuit potential-time (OCP-t) technique are used to analyze the structure of the catalyst, the process of catalyzing copper deposition and induced rate of the electroless copper deposition. We also demonstrate that the polyurethane resin catalyst containing silver ion can be screen printed onto the PET substrate, then, a Cu pattern is successfully fabricated on the PET after electroless copper plating.

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Periodical:

Advanced Materials Research (Volumes 550-553)

Pages:

2019-2023

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.550-553.2019

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Online since:

July 2012

Authors:

Qiong Yang, Shi Rong Chen, Guan He Luo, Guang Hui Hu, Zhan Chang Pan, Yi Wang, Xin Long Tian

Keywords:

Electroless Copper Plating, Open Circuit Potential-Time (OCP-t) Technique, Silver Catalyst

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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