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The Preparation and Characterization of Electroless Copperplating Low- Temperature Expandable Graphite

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Abstract:

Copper coating was deposited on the surface of low-temperature expandable graphite (LTEG) by electroless plating method. The effects of reaction temperature, Ni2+ concentration and pH value on the copper deposited low-temperature expandable graphite (CDLTEG) were discussed. The experimental results show that reaction temperature of 65~70°C, Ni2+ concentration of 0.006mol/L~0.008mol/L and pH value of 9~10 are the ideal reaction condition for CDLTEG. X ray diffraction analysis indicates that perfect copper cladding can be coated on LTEG through chemically plating method. It is found by thermogravimetric analysis that the depositing process of copper upon LTEG is exothermic. the oxidation of copper would obviously occur when temperature is higher than 270.8 °C, so CDLTEG should be expanded to prepare its expanded outcome at a lower temperature than 270.8 °C. The 3 mm wave dynamics test makes it clear that deposited copper has an obvious improvement effect on 3mm wave attenuation performance of LTEG.

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Periodical:

Advanced Materials Research (Volumes 557-559)

Pages:

1492-1496

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.557-559.1492

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Online since:

July 2012

Authors:

Xue Mei Lin, Jian Shen, Shao Xiong Zhang

Keywords:

3mm Wave Attenuation, Effect, Electroless Copperplating, Low Temperature Expandable Graphite, Performance Characterization

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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