Development of a New Adhesive Reagent for Shell Mold Having High Adhesive Strength

Abstract:

A new adhesive reagent has been developed for the fabrication of shell mold with the adhesive strength under high temperature. The new adhesive reagent was prepared by mixing inorganic precursors of alkyl silicate and sodium alkoxide, starting particle composed of silica (SiO2) and alumina (Al2O3) used as substrate in the conventional mold process, and colloidal silica. Inorganic precursor was used to increase the adhesive strength of mold, resulting from the glass phase generated by the sol-gel reaction and glassification of precursors. In addition, colloidal silica and starting particle were added to control the viscosity of adhesive reagent, inducing the availability of adhesive reagent. In the case of mold sample adjoined by the new adhesive reagent the glass phase is well formed at the interface between adhesive reagent and substrate, compared with those made with the conventional adhesive reagents such as a mortar and a sand bond. This leads to the increase in the adhesive strength of shell mold, preventing the collapse of the mold at a high temperature during casting process. Therefore, the new adhesive reagent could desirably prepare shell mold without an additional process to enhance the adhesive strength in the conventional casting process.

• Periodical: Advanced Materials Research (Volumes 560-561)
• Pages: 391-394
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.560-561.391
• Online since: August 2012
• Authors: Eun Hee Kim, Geon Ho Jo, Je Hyun Lee, Zhe Lu, Yeon-Gil Jung
• Keywords: Adhesive Reagent, Adhesive Strength, Colloidal Silica, Glass Phase, Inorganic Precursor

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