Stick-Slip Simulation of Feeding System in Silicon Ultra-Precision Grinding Machine

Abstract:

Mono-crystalline silicon is the typical substrate material in integrated circuits manufacturing, and machining precision and surface quality of the silicon wafer impacts on the quality and performance of the electronic products directly. Silicon grinding technology has high accuracy, low cost and can obtained high surface quality, which has become the mainstream of silicon ultra-precision machining. Stick-slip of feeding system in silicon ultra-precision grinding machine is an important factor which influencing the machining precision of the silicon wafer. In this paper, based on the structure analysis of feeding system in a certain type of silicon ultra-precision grinding machine, the rigid body coupling virtual prototype model of the feeding system is established using ADAMS, the factors which influencing the stick-slip is analyzed deeply via the dynamic simulation of the virtual prototype.

• Periodical: Advanced Materials Research (Volume 566)
• Pages: 530-533
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.566.530
• Online since: September 2012
• Authors: Zhi Hua Sha, Shao Xing Zhang, Yi Wang, Sheng Fang Zhang
• Keywords: Feeding System, Silicon Ultra-Precision Grinding Machine, Simulation, Stick-Slip

References

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