Assessment on Copper C194 Mechanical Properties Variations in Typical Semiconductor Assembly Production Line

Abstract:

Process variation is inevitable for any production line regardless of the industry. The trend for smaller, lighter yet multifunctional devices has created high expectation for the semiconductor manufacturer to produce more robust and highly reliable devices. One way to achieve this is by assessing the variance performance of the assembly production. In this study, the mechanical properties of copper alloy C194 used as the lead frame for particular IC device have been investigated. Samples from control and defect groups been subjected to hardness (Rockwell test) and tensile (Instron test) while the optical microscopy used to verify the microstructure. The result shows that the hardness and tensile of the defect group is relatively lower than the control group while the elongation of the defect group is almost 10% higher. This finding is very useful to be shared with the process owner so that in-depth investigation on the lead frame material consistency or the temperature range optimization can be carried out to prevent such variations that contribute to the inconsistence wire bond yield performance.

• Periodical: Advanced Materials Research (Volume 576)
• Pages: 523-526
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.576.523
• Online since: October 2012
• Authors: Abdullah Rashid Amirul, Saad Nor Hayati, Bulan Abdullah
• Keywords: Mechanical Property, Non-Sticking Defect, Process Variation

References

[1] N. M. Lellan (2001). A revolution in packaging technology. Retrieved May 7, 2011 from http: /www. future-fab. com/documents. asp?grID=217&d_ID=661.

[2] Z. Dexin, H.J. Song, Y. Li, H.B. Tan and P. Qianghua (2006).

[3] M.C. Nadeau, A. Kar, R. Roth, R. Kirchaain (2010). A dynamic process-based cost modeling approach to understand learning effects in manufactuting. International Journal of Production Economics , 128(1): 223-234.

DOI: 10.1016/j.ijpe.2010.07.016

[4] O.D. Patterson X.B. Dong P.P. Khargonekar, V.N. Nair (2003).

[5] S. Chandra, K. Lahiri, A. Ragunathan, S. Dey J (2010). Variation-Aware System-Level Power Analysis. Ieee Transactions on Very Large Scale Integration (Vlsi) Systems 18(8): 1173-1184.

DOI: 10.1109/tvlsi.2009.2021478

[6] S. Shedable, et al (2008). Statistical modeling of the variation in advanced process technologies using a multi-level partitioned response. Circuits, devices & Systems, IET, vol 2, pp.451-464.

DOI: 10.1049/iet-cds:20080031

[7] F. Huang, et al., The investigation of some properties of copper alloys for lead frame, in Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on, 2000, pp.391-393.

[8] C.W. Tan and Y.C. Chan (2004). A study on the reliability and thermo-mechanical properties of gold ribbon wire bonding. Proceeding of Electronic Components and Technology, Vol. 1, pp.377-382.

DOI: 10.1109/ectc.2004.1319368

[9] G.G. Harman (1997). Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield. Mcgraw Hill, NY.

[10] K.S. Goh and Z.W. Zhong (2007). A new bonding-tool solution to improve stitch bondability. Microelectronic Engineering. 84(1): 173-179.

DOI: 10.1016/j.mee.2006.10.066

[11] S.K. Prasad (2004). Advanced wirebond interconnection technology: Kluwer Academic Publishers, Boston.

[12] A. Bastos, et al., Characterization of the microstructure and texture of nanostructured electrodeposited NiCo using electron backscatter diffraction (EBSD), Acta materialia, vol. 54, pp.2451-2462, (2006).

DOI: 10.1016/j.actamat.2006.01.033