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Kinematic Analysis and Simulation of MID Laser Direct Structuring Equipment
Abstract:
Molded Interconnect Devices (MID) is an innovative technology in the field of mechatronics which abandons the conventional circuit boards and integrates the mechanical and electronic functions directly on the 3D injection molded thermoplastics. The Laser Direct Structuring (LDS) is the most efficient and advanced technology for the manufacrure of MID. In this paper, LDS technology and equipment have been introduced. Then through kinematic modeling analysis of the LDS equipment, getting the forward and inverse solution of laser focus position in the 3D space. And the LDS equipment processing path has been planned based on the kinematic analysis. Finally the simulation system of LDS has been developed based on Open CASCADE in order to inprove the processing efficiency and quality of MID.
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236-241
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Online since:
November 2012
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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