Investigation of Low-Cost Copper Interconnection Cleaning Using Hydrogen Radicals Generated by Heated Catalyst

Y. Kumashiro; S. Ikeda; Akira Izumi

doi:10.4028/www.scientific.net/AMR.602-604.1379

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 602-604Investigation of Low-Cost Copper Interconnection...

Investigation of Low-Cost Copper Interconnection Cleaning Using Hydrogen Radicals Generated by Heated Catalyst

Abstract:

We investigated hydrogen radical copper cleaning via the hot-wire method using only a rotary pump for the vacuum exhaust system. The copper oxide surface was successfully reduced. The treatment also increased the resistance of copper to oxidation.

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Periodical:

Advanced Materials Research (Volumes 602-604)

Pages:

1379-1382

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.602-604.1379

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Online since:

December 2012

Authors:

Y. Kumashiro, S. Ikeda, Akira Izumi

Keywords:

Cu Oxide, Hot-Wire, Hydrogen Radical, Interconnection Cu, Reduction

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