Fabrication and Characterization of Chromium-Coated Graphite Fibers Reinforced Copper Matrix Composites

Hao Ming Zhang; Xin Bo He; Xuan Hui Qu

doi:10.4028/www.scientific.net/AMR.602-604.3

Paper Titles

Preface and Conference Organization

Fabrication and Characterization of Chromium-Coated Graphite Fibers Reinforced Copper Matrix Composites
p.3

Effective Means of Microstructure Homogenization for AgMeO: Cumulative Extrusion Severe Plastic Deformation
p.8

Oxidation Resistance of Graphite-SiAlON Bonded SiC Composite
p.13

Influence of Thermite Reaction on the Microstructures and Properties of Cast-Infiltration Composite Layer
p.18

Effects of High Temperature on Tensile and Bending Strengths of T300 Carbon Fiber Three Dimensional Braided Composites
p.23

Structure-Property Correlation of Composites Impregnated with Aspartimide Oligomer
p.28

Study on the Resin Curing Time and the Mechanical Properties of the Composites
p.33

Ag Supported Si-Doped Graphene for Hydrogen Sulphide Detection: A First-Principles Investigation
p.37

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 602-604Fabrication and Characterization of...

Fabrication and Characterization of Chromium-Coated Graphite Fibers Reinforced Copper Matrix Composites

Abstract:

Milled form of mesophase pitch-based graphite fibers were coated with a chromium layer using chemical vapor deposition technique, and Cr-coated graphite fiber/Cu composite with 50 vol.% fibers was fabricated by hot-pressing. The composite was characterized with scanning/transmission electron microscopies and by measuring thermal properties, including thermal conductivity and coefficient of thermal expansion (CTE). The results showed that the milled fibers were preferentially oriented in a plane perpendicular to the pressing direction, leading to anisotropic thermal properties of the composite. The Cr coating reacted with graphite fiber and formed to a continuous and uniform Cr₃C₂ layer. This carbide layer established a good metallurgical interfacial bonding in the composite, which can improve the thermal properties effectively. The in-plane thermal conductivity and CTE of the composite reached to 392 W/mK and 6.5 ppm/K respectively, making the composite suitable for being electronic packaging materials.