Temperature Uniformity Control in the Low Pressure Process Champer of the IC Equipment

Abstract:

The production of IC equipments requires tight control of temperature uniformity within the substrates during the vacuum deposition process chamber. Though traditional approaches such as PID control methods result in substantial improvements, but they fail in meeting the stringent requirement of less than 1°C variation to guarantee the long-term stability of the temperature. To this end, this paper describes the application of information fusion closed-loop control system.A heater structure was designed and the heating wire was divided into 3 sections. Then a multi-loop temperature coordinated control system model has been developed and the temperature heating process has been divided into five intervals. In order to achieve the desired temperature uniformity of 1°C, information fusion technology was used to predict the parameters of PID controller. Through experiments, the coordinated control system model can attaining the desired uniformity levels.

• Periodical: Advanced Materials Research (Volumes 605-607)
• Pages: 1552-1556
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.605-607.1552
• Online since: December 2012
• Authors: Hui Huang, Tie Niu Yang, Chang Ming Li, Qi Li Zhang, Zun Di Huang
• Keywords: IC Equipments, Information Fusion, Temperature Uniformity

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