Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder

Abstract:

Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper focuses on the intermetallic compound (IMC) formation study between the fabricated solder composite on Cu-substrate. Throughout this study, four different composition of Sn-0.7Cu/re-Al (0.0, 3.0, 3.5, 4.0 wt.%) were studied. X-ray diffraction (XRD) was used to analyze the IMCs phase formation between the interfaces. New IMC phase of Cu₉Al₄ was detected beside Cu₆Sn₅ and Cu₃Sn in the composite solder samples. However, Sn-0.7Cu/3.0re-Al showed least formation of brittle IMCs compared to the monolithic solder.

• Periodical: Advanced Materials Research (Volume 620)
• Pages: 105-111
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.620.105
• Online since: December 2012
• Authors: Flora Somidin, Mohd Arif Anuar Mohd Salleh, Khairel Rafezi Ahmad
• Keywords: Composite Solder, Intermetallic Compound, Powder metallurgy, Recycle-Aluminum, Sn-0.7Cu

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