The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder

Abstract:

Electromigration effects on the solder joint formation of 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu lead-free solder with Cu electroplated Ni layer wire were investigated. The electromigration effects on the solder joints were studied after current density stressing at 1 x 10³ A/cm² in room temperature for 0 h, 120 h, and 240 h. The research work found that intermetallic compound (IMC) formation on the joint is increases for both solders with longer period of current stress applied. Higher IMC thickness growth in 99.3Sn-0.7Cu solder joint compared to 99.3Sn-0.7Cu is detected and both anode regions of the solder joints show higher IMC thickness growth compared to cathode region. Experimental results show 99.3Sn-0.7Cu solder joint is more prone to failure under current stress compared to 96.5Sn-3.0Ag-0.5Cu solder joint with thicker IMC which translates to higher brittleness.

• Periodical: Advanced Materials Research (Volumes 622-623)
• Pages: 195-199
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.622-623.195
• Online since: December 2012
• Authors: Mohd Arif Anuar Mohd Salleh, A.R. Nik Nurhidayatul Suhada, Flora Somidin, Khairel Rafezi Ahmad, C.S. Lee, Hussin Kamarudin
• Keywords: Current, Electromigration, Lead Free, Solder Joint, Stress

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