Wire Bond Shear Test Simulation on Hemispherical Surface Bond Pad

Abstract:

Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this study, simulation on wire bond shear test is done to evaluate the stress response of the bonded wire when sheared on a hemispherical surface bond pad. The contrast between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were carry out to examine the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

• Periodical: Advanced Materials Research (Volumes 622-623)
• Pages: 643-646
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.622-623.643
• Online since: December 2012
• Authors: Z. Sauli, V. Retnasamy, W.M.W. Norhaimi, J. Adnan, M. Palianysamy
• Keywords: ANSYS, Hemisphere Surface Bond Pad, Shear Test, Wire Bond

References

[1] Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh and Yi-Shao Lai, Characteristic of copper wire and transient analysis on wirebonding process, Microelectronics Reliability 51, 2011, p.179–186.

DOI: 10.1016/j.microrel.2010.11.008

[2] Y. Takahashi and M. Inoue, Numerical Study of Wire Bonding-Analysis of Interfacial Deformation between Wire and Pad, Journal of Electronic Packaging, vol. 124, pp.27-36, (2002).

DOI: 10.1115/1.1413765

[3] Jun He; Ping Zhu, Parameter Sensitivity Analysis for Thermosonic Bonding Process by Finite Element Method, Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on, vol., no., pp.1-8, 14-17 Aug. (2007).

DOI: 10.1109/icept.2007.4441509

[4] Degryse, D.; Vandevelde, B.; Beyne, E.; , Mechanical FEM Simulation of bonding process on Cu lowK wafers, Components and Packaging Technologies, IEEE Transactions on , vol. 27, no. 4, pp.643-650, Dec. (2004).

DOI: 10.1109/tcapt.2004.838862

[5] Chang-Lin Yeh; Yi-Shao Lai; Chin-Li Kao; Transient simulation of wire pull test on Cu/low-K wafers, Advanced Packaging, IEEE Transactions on , vol. 29, no. 3, pp.631-638, Aug. (2006).

DOI: 10.1109/tadvp.2006.875081

[6] Xingjia Huang; Lee, S. -W.R.; Chien Chun Yan; Hui, S.; , Characterization and analysis on the solder ball shear testing conditions, Electronic Components and Technology Conference, 2001. Proceedings., 51st , vol., no., pp.1065-1071, (2001).

DOI: 10.1109/ectc.2001.927949

[7] JEDECSTANDARD Wire Bond Shear Test Method, JESD22-B116A, JEDEC Solid State Technology Association, August (2009).