Metal-Metal Bonding Process Using Ag2O/CuO Mixed Particles

Takafumi Maeda; Yoshio Kobayashi; Yusuke Yasuda; Toshiaki Morita

doi:10.4028/www.scientific.net/AMR.622-623.945

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 622-623Metal-Metal Bonding Process Using Ag2O/CuO Mixed...

Metal-Metal Bonding Process Using Ag₂O/CuO Mixed Particles

Abstract:

The present study describes metal-metal bonding process using mixture of CuO nanoparticles and Ag₂O nanoparticles (Ag2O/CuO mixed particles). The leaf-like aggregates with a longitudinal size of 1116 nm and a lateral size of 460 nm composed of CuO nanoparticles with a size of ca. 10 nm and the Ag₂O nanoparticles with a size of 20.6 nm were fabricated with a salt-base reaction. Metal-metal bonding could be successfully performed by using the mixed particles as a filler sandwiched between metallic discs and pressurizing the discs at 1.2 MPa for 5 min under annealing in H2 gas at 400oC. The mixed particles bonded not only metallic Cu discs but also metallic Ag discs strongly; The shear strengths were as large as 17.3 and 22.4 MPa for the Cu discs and the Ag discs, respectively.

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Periodical:

Advanced Materials Research (Volumes 622-623)

Pages:

945-949

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.622-623.945

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Online since:

December 2012

Authors:

Takafumi Maeda, Yoshio Kobayashi, Yusuke Yasuda, Toshiaki Morita

Keywords:

Copper Oxide, Metal-Metal Bonding, Nanoparticle, Silver Oxide

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