Heat Design of Multi-Functional Structure of Electronic Equipment with Material Properties in Control System

Abstract:

In this paper, the multifunctional structure was designed in electronic equipment of the control system, reducing the weight in the housings of the electronic equipment, wire and cable. The functions of thermal design and dynamic design and protection design were completed by using structure. The qualitative analysis of the center control unit structure model was done. Thermal analysis and the thermal design of the multifunctional electronic equipment structure were finished on the basis of the thermal design principles and attention of the matters. The cooling capacity was increased by fin structure with the cold plate. The modeling analyses of the same multi- functional structure with different fin spacing and height were completed in Icepak. The curves of the maximum temperature for the multi-functional structures corresponding to a group of fin height were got. The high-power MCM chip was placed in the middle of the multifunctional structure, and the remaining low-power chips were distributed around, which can reduce the thermal coupling of the chip, reducing the overall temperature of the multi-functional structure effectively, which has certain theoretical significance to the design of today’s electronic devices.

• Periodical: Advanced Materials Research (Volume 625)
• Pages: 159-166
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.625.159
• Online since: December 2012
• Authors: Jun Hui Wu, Quan Zhou, Qiang Zhou, Jie Chen, Hui Ping Si, Kai Yan Lin, Chi Bin Zhang
• Keywords: Fin Structure, Multifunctional Structure, Structure Model, Temperature, Thermal Analysis, Thermal Design

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