Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive

Abstract:

The rheological mechanical properties of two kinds of self-designed epoxy adhesive curing systems were studied in this paper through the dynamic and static thermodynamics instrument named EPLEXOR 500N made by GABO® company in Germany. Short-term creep tests were carried out under three different temperature conditions of 20°C, 30°C and 40°C and the rheological model is developed to describe the materials creep law. In addition, the test results from the two different epoxy adhesive are also compared and analyzed.

• Periodical: Advanced Materials Research (Volumes 639-640)
• Pages: 354-358
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.639-640.354
• Online since: January 2013
• Authors: Hui Li, Ying She Luo, Jian Jun Xie, Sheng Ming Chen
• Keywords: Creep Test, Epoxy Adhesive, Rheological Mechanical Property, Rheological Model, Room-Temperature

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