Preparation and Curing Behaviour of N-Phenylmaleimide-Styrene-Maleic Anhydride Copolymer/o-Cresol Formaldehyde Epoxy Resin Composite System

Meng Yi Xu; Liang Zhou; Mei Juan Yin; Ai Qiong Kong

doi:10.4028/www.scientific.net/AMR.646.30

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The Synthesis and Bioactivities of 2-Hydroxyethyl Benzo[d] Isothiazole-3(2H)-One Marine Antifouling Paints
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Preparation and Curing Behaviour of N-Phenylmaleimide-Styrene-Maleic Anhydride Copolymer/o-Cresol Formaldehyde Epoxy Resin Composite System
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 646Preparation and Curing Behaviour of...

Preparation and Curing Behaviour of N-Phenylmaleimide-Styrene-Maleic Anhydride Copolymer/o-Cresol Formaldehyde Epoxy Resin Composite System

Abstract:

Epoxy resin was used as the dielectric ink with some undesirable properties, such as a high dielectric constant, high dissipation factor and low thermal stability, In this paper, a NSMA/OCFEP.system were prepared, and the properties and curing behavior of the NSMA/ OCFEP system were intensively studied. Theoretical analysisi on the curing process of the system showed that when the weight ratio is 2.0:1.0, the best thermal stability is achieved.

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Periodical:

Advanced Materials Research (Volume 646)

Pages:

30-33

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.646.30

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Online since:

January 2013

Authors:

Meng Yi Xu, Liang Zhou, Mei Juan Yin, Ai Qiong Kong

Keywords:

Curing Process, DSC/TG Analysis, NSMA/OCFEP Composite System

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References

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