Methods of Errors Analysis in Assembly of Dicing Saw in Silicon Devices with Material Properties and Applied Mechanics

Yan Ma

doi:10.4028/www.scientific.net/AMR.648.162

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The Manufacture and Nutritional Analysis of the Dioscorea batatas F.flablla.Makiro Jam with Material Properties
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p.162

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Equivalent Stress Analysis of Piercing Process in Diescher’s Mill Using Finite Element Method
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 648Methods of Errors Analysis in Assembly of Dicing...

Methods of Errors Analysis in Assembly of Dicing Saw in Silicon Devices with Material Properties and Applied Mechanics

Abstract:

Mainly introduce the work principle of Dicing Saw and the different kinds of errors in assembly ,analyze all errors which influence LCD glass ; draw the picture according to the measuring data ,from the picture estimate the errors how to come from and prove that the judgments is true through calculating the rigidity of liner bearing ;find the source of the main error ,appoint out how to take measures for the errors and what is the key point in the assemble. This errors analysis method of the applied mechanics play an important role in other Dicing Saw assemble and test .

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Periodical:

Advanced Materials Research (Volume 648)

Pages:

162-165

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.648.162

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Online since:

January 2013

Authors:

Yan Ma

Keywords:

Dicing Saw, Material Property, Measure Errors, Silicon Devices

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