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Microstructure and Growth Behavior of the Intermetallic Compound for Sn-1.0Ag-0.5Cu-NiB/Cu Solder Joint Interface

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Abstract:

This research investigates the microstructure and growth behavior of the intermetallic compound(IMC) of Sn-1.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu-0.05Ni and Sn-1.0Ag-0.5Cu-0.05N-0.02B/Cu solder joint interface. The interfacial reactions between Cu and the solders at 250±1°C were examined. Experimental results indicated that the IMCs of the above alloy systems on the soldering interface were Cu6Sn5 and (Cux, Ni1-x)6Sn5, respectively. The grain size of primary Sn decreased observably with the micro addition of B and a large number of fine reinforcement particles were found in the solder. With the aging time increasing, the (Cux, Ni1-x)6Sn5 micrograph of the Sn-1.0Ag-0.5Cu-0.05N-0.02B solder joint interface was changed from sawtooth-like to shape-layer, but the thickness of IMCs increased unobservably.

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Periodical:

Advanced Materials Research (Volumes 652-654)

Pages:

1106-1110

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.652-654.1106

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Online since:

January 2013

Authors:

Jun Feng Qu, Jun Xu, Qiang Hu, Fu Wen Zhang

Keywords:

B Addition, Interfacial Reaction, Intermetallic Compound, Leader-Free Solder, Sn-1.0Ag-0.5Cu-Nib

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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