Using FEA Simulation and Experimental Models of Flexible Substrates to Assist the Technology of Miniaturization of Electronic Devices

Abstract:

• Periodical: Advanced Materials Research (Volumes 655-657)
• Pages: 1619-1627
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.655-657.1619
• Online since: January 2013
• Authors: Luciano Arruda

References

[1] Zhang, G. Q.; van Driel, W.D.; and X.J. Fan – Mechanics of Microelectronics – Solid Mechanics and Its Applications. Springer, 2006, Netherlands.

[2] Arruda, L. O. ; Bonadiman, Renato ; Costa, Josineto ; Reinikainen, Tommi . Cracking phenomena on flexible-rigid interfaces in PCBs under thermo cycling loading. Circuit World, v. 35, pp.18-22, (2009).

DOI: 10.1108/03056120910953277

[3] Arruda, L. O. On the Simulation of Flexible Circuit Boards In: EMPC2007 - 30th ANNIVERSARY CONFERENCE OF IMAPS, 2007, Oulu.  EMPC2007 - European Microelectronics and Packaging Conference & Exhibition in Oulu, Finland June 17-20, 2007. IEEE, (2007).

[4] Arruda L.O.; Machado W.;, Andolfatto, M.; Experimental Analysis of Propagation of the Delamination in Flex-PCBs Subjected to Thermal Cycling Loading In: 2010 International Conference on Electronic Packaging Technology & High Density Packaging, 2010, Xi'an. 2010 International Conference on Electronic Packaging Technology & High Density Packaging. Xi an: IEEE, 2010. p.1314.

DOI: 10.1109/icept.2010.5582797

[5] Arruda, L. O. & Freitas, G., Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME 2007, Apr, London, ENGLAND, 2007, pp.: 16-18.

DOI: 10.1109/esime.2007.360039

[6] Arruda, L. O.; Bonadiman, R,; Costa, J.; & Freitas, G. Experimental and Numerical Analyses of Flexible PCBs under Various Loading Conditions, Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME 2009, Delft/Holland, NL, May (2009).

DOI: 10.1109/esime.2009.4938493

[7] Arruda L.O.; Marinho, L. D; Silva, E. & Machado, W. Flexible Circuits with Embedded Resistors Subjected to Extreme Thermal Loading Conditions Using the Shadow Moiré and FEM Measurements Techniques In: Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME 2010, 2010, Bordeaux. Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME 2010. , (2010).

DOI: 10.1109/esime.2010.5464575

[8] ANSYS, Electronics Manual, Version 11. 0, USA.

[9] ABAQUS, Electronics Manual, Version 6. 8, USA.