A Novel Patternable Electrophoretic Polymer Coating for Sidewall Packaging in Microelectronic Devices

Yi Bo Wu; Guo You Liu; Hong Wang; Gui Fu Ding

doi:10.4028/www.scientific.net/AMR.658.134

Paper Titles

RF Characteristics of SiO₂/HfO₂/SiO₂ MIM Capacitor
p.112

Dielectric Relaxation and Reliability of Al₂O₃-HfO₂-Al₂O₃ Sandwiched Metal-Insulator-Metal (MIM) Capacitor
p.116

Polycrystalline Silocon-Oxide-Nitride-Oxide-Silicon Flash Memory on SiO₂ and Si₃N₄ Buffer Layer for System on Panels Application
p.120

Estimation of Tension Force in Short Hangers Using Added Mass Method
p.124

A Novel Patternable Electrophoretic Polymer Coating for Sidewall Packaging in Microelectronic Devices
p.134

Investigates of Fabric Coating Approaches: Process and Observation
p.140

Investigates of Fabric Coating Approaches: Parameters for Fabric Performance
p.147

Chemical Recycling of Epoxide-Anhydride Hardened Networks Using Near-Critical Water
p.153

Structure and Performance of Fe-Al Alloy Layer for Twin Wire Surfacing on the Steel Substrate
p.158

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 658A Novel Patternable Electrophoretic Polymer...

A Novel Patternable Electrophoretic Polymer Coating for Sidewall Packaging in Microelectronic Devices

Abstract:

This paper presents a novel patternable electrophoretic polymer (EPP) coating technology for sidewall package in microelectronic devices. The main features of this EPP film are directly patterned via through-mask electrophoretic deposition. The proposed EPP coating has some overwhelming merits against other coating polymers, such as self-patterning via through-mask deposition, good adhesive performance, selective coating, low cost and compatible with IC process. The focus is on the process, patterning, properties characterization and application of this novel electrophoretic polymer. The main applications can be aimed for electrical/thermal isolations or sidewall packaging in semiconductor device package.

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Periodical:

Advanced Materials Research (Volume 658)

Pages:

134-139

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.658.134

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Online since:

January 2013

Authors:

Yi Bo Wu, Guo You Liu, Hong Wang, Gui Fu Ding

Keywords:

Electrophoresis Coating, Microelectronic Device, Micromaching Process, Patternable Microstructures, Polymer Thin Film, Sidewall Packaging

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