The Mechanical Reliability of a Commercial MEMS Microphone

Abstract:

This paper describes our recent work on the mechanical reliability of a commercial MEMS microphone by performing three mechanical tests, i.e. a constant acceleration test, a mechanical shock test, and a random vibration test, according to the standard of Mil-Std-883. We find that, the studied MEMS part of the microphone can survive a stress limit above 20000g. Two failure modes, i.e. the breaking of diaphragm and the backplate and the delamination of the electrode from the backplate are revealed in the three tests.

• Periodical: Advanced Materials Research (Volume 662)
• Pages: 551-555
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.662.551
• Online since: February 2013
• Authors: Wen Xiao Fang, Qin Wen Huang
• Keywords: Mechanical Reliability, MEMS, Microphone

References

[1] A. L. Harzell, M. G. da Silva and H. R. Shea: MEMS Reliability (Springer, USA, 2010).

[2] O. Tabata and T. Tsuchiya: Reliability of MEMS (Wiley-VCH, Germany, 2008).

[3] Richard Nass: MEMS are finding homes in unexpected places, Portable Design, August (2003).

[4] MEMS Industry Group, MIG Industry Report: Focus on Reliability (2004).

[5] J. Zunino and D. Skelton: Proc. of SPIE. (2006), p.5716.

[6] Merlijn van Spengen: Microelectronics Reliability Vol. 43 (2003), p.1049.

DOI: 10.1016/s0026-2714(03)00119-7

[7] J. Bergqvist and F. Rudolf: Sensors and Actuators A, Vol. 21(1990), p.123.

[8] D. Hohm and G. Hess: Journal of the Acoustical Society of America, Vol. 85(1989), p.476.

[9] J. Hillenbrand and G. M. Sessler: Journal of the Acoustical Society of America, Vol. 116 (2004), p.3267.