Finite Element Simulation of Precision Cutting Monocrystalline Silicon

Li Qiu Shi; Xiao Wen Li; Feng Yu

doi:10.4028/www.scientific.net/AMR.662.99

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 662Finite Element Simulation of Precision Cutting...

Finite Element Simulation of Precision Cutting Monocrystalline Silicon

Abstract:

Monocrystalline silicon is typical of hard brittle materials, a high surface quality can be obtained in ductile-regime cutting. The success of the turning process depends on optimizing the machining parameters such as the tool edge radius, tool rake angles, depth of cut and cutting speed, etc. In this study, based on the ductile–brittle transition mechanism, the optimization of cutting parameters were determined with the commercial, general purpose FEA software Msc.Marc. The result demonstrates that the value of temperature is minimum when the tool rake angle is in the range of -15º～-30º. Smaller tool edge radius was selected while maintaining quality of tool edge radius and tool life. As long as beyond the range of cutting speed 6 ~ 8 mm/s, smaller residual stress can be obtain.

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Periodical:

Advanced Materials Research (Volume 662)

Pages:

99-102

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.662.99

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Online since:

February 2013

Authors:

Li Qiu Shi, Xiao Wen Li, Feng Yu

Keywords:

Finite Element Method (FEM), Monocrystalline Silicon, Precision Machining

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