Micro-Compression Testing of TSV Copper Pillar: An In Situ Method and Mechanical Property

Ting Gu; Ping Cheng; Hui Ying Wang; Xu Han Dai; Hong Wang; Gui Fu Ding

doi:10.4028/www.scientific.net/AMR.663.352

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 663Micro-Compression Testing of TSV Copper Pillar: An...

Micro-Compression Testing of TSV Copper Pillar: An In Situ Method and Mechanical Property

Abstract:

This paper puts forward an in-situ testing method for the mechanical properties of TSV copper pillar by using micro-compression experiment. The sample for micro-compression test is prepared by the processes as follows: (a) etching TSV with deep reactive ion etching (DRIE), (b) sputtering a layer of Ti/Cu as the seed layer, (c) TSV copper plating technology, and (d) corroding the silicon to obtain the final specimen. The micro compression test is done with a micro-compression system, consisting of a three-dimensional adjustable stage, a microscope, a force sensor, and a piezoelectric motor. The experimental results show that the platform can test TSV copper pillar’s stress, the accuracy is reached mN. The yield strength of TSV copper pillar is about 199.89 MPa.

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Periodical:

Advanced Materials Research (Volume 663)

Pages:

352-356

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.663.352

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Online since:

February 2013

Authors:

Ting Gu, Ping Cheng, Hui Ying Wang, Xu Han Dai, Hong Wang, Gui Fu Ding

Keywords:

In Situ Measurement, Mechanical Property, Micro-Compression, TSV Copper Pillar

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