The Study on Subsurface Damage Depth and Morphology of Optical Material

Wei Yang; Hui Ye

doi:10.4028/www.scientific.net/AMR.675.227

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 675The Study on Subsurface Damage Depth and...

The Study on Subsurface Damage Depth and Morphology of Optical Material

Abstract:

The paper is mainly to research the subsurface damage depth and morphology on grinding and polishing substrates on optical materials, and analyze different subsurface damage morphologies caused by different processing technologies. The best etching solution is selected by experiments, grinding and polishing substrates are etched for proper time by divided stages. Use 120×optical microscope and scanning electronic microscope to observe subsurface damage morphology and Taylor Hobson PGI1240 to measure the etching depth to obtain the subsurface damage depth.

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Periodical:

Advanced Materials Research (Volume 675)

Pages:

227-230

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.675.227

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Online since:

March 2013

Authors:

Wei Yang, Hui Ye

Keywords:

Depth, Grinding, Morpholoy, Polishing, Subsurface Damage

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References

[1] Yinxia Zhang. Detection on ultraprecise process suface/subsurface damage of monocrystalline silicon. IC engineer unicircuit and component, 2004, 7: 72~75.

Google Scholar

[2] Gailin Li, Yulie Wu, Zhuo Wang etc. Destructive detection technology on optical elements subsurface damage depth. Aviation precision manufacturing technology, 2006, 42（6）: 19~22.

Google Scholar

[3] Shen J., Liu S.H., Yi K., et al. Subsurface damage in optical substrates. Optical, 2005, 116：288～294.

Google Scholar

[4] NingChen, Qinghua Zhang, Qiao Xu etc. Subsurface damage detection and chemical corrosion technology for K9. Strong laser and particles bunch, 2005, 17（9）: 1289~1293.

Google Scholar

[5] Bi Zhang, JianMeng. Nanotechnology and precision engineering. Optical, 2003, 1(1)：48～56.

Google Scholar

[6] Gailing Li, Kaiyuan Sun, Renyu Feng etc. Subsurface damage mechanism and detection method. Colliery machinery, 2008, 29（12）: 99~100.

Google Scholar