Investigation for the Fracture Process of WCp/Cu Functionally Graded Materials under Three-Point-Bending

Hai Ting Xia; Rong Xin Guo; Feng Yan; Hai Yu; Yu Bo Zhang

doi:10.4028/www.scientific.net/AMR.683.17

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 683Investigation for the Fracture Process of WCp/Cu...

Investigation for the Fracture Process of WC_p/Cu Functionally Graded Materials under Three-Point-Bending

Abstract:

In this paper, the fracture process of WCp/Cu functionally graded materials(FGMs) was investigated. The used materials were fabricated by powder metallurgy using tungsten carbide(WC) particles and copper(Cu) matrix, and had functionally graded layers. In order to investigate the fracture process of the FGM, three-point-bending tests of rectangular specimens were carried out. From the results, it can be seen that the bending performance of FGM structures with increasing WC content from head layer to the bottom layer excels that of FGM structures with decreasing WC content in three-point-bending tests.

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Periodical:

Advanced Materials Research (Volume 683)

Pages:

17-20

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.683.17

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Online since:

April 2013

Authors:

Hai Ting Xia, Rong Xin Guo, Feng Yan, Hai Yu, Yu Bo Zhang

Keywords:

Experimental Mechanics, Fracture Process, Functionally Graded Material (FGM), Three-Point-Bending

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