Effect of Spark Plasma Sintering Temperature on Microstructures and Properties of Copper-Diamond Composites

Abstract:

Temperature being one of the most important parameters of Spark plasma sintering (SPS) and its effects on the microstructures as well as on the physical properties of copper diamond composites fabricated by mechanical mixing of copper with 70 vol.% diamond powders, precoated with 1 wt% chromium has been studied. Experiments were performed at 900°C, 1000°C and 1100 °C for 10 minutes under 50 MPa. The results reveal that sintering temperature highly influences the copper/diamond interface bonding and microstructures. The composite’s properties like thermal conductivity (T.C), specific heat (Cp), diffusivity (Dff) and relative density (ρr) were also highly influenced by temperature variations. Except the relative density, all the other properties increased respectively with increasing sintering temperature.

• Periodical: Advanced Materials Research (Volume 683)
• Pages: 573-576
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.683.573
• Online since: April 2013
• Authors: Abdul Rehman Niazi, Shu Kui Li, Ying Chun Wang, Jin Xu Liu, Zhi Yu Hu, Usman Zahid
• Keywords: Diamond/Copper Composites, Diffusivity, Spark Plasma Sintering (SPS), Specific Heat, Thermal Conductivity (TC)

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