Study on the Conversion Method of Three-Dimensional Shape Prediction Model of BGA Solder Joints

Hua Bin Zhao; De Jian Zhou

doi:10.4028/www.scientific.net/AMR.706-708.1693

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 706-708Study on the Conversion Method of...

Study on the Conversion Method of Three-Dimensional Shape Prediction Model of BGA Solder Joints

Abstract:

In the study of three-dimensional shape prediction of SMT solder joints, the software Surface Evolver has been widely applied as a quick and accurate effective tool for the prediction of solder joints shape. But the model it builds is not able to be directly imported into any finite element analysis software like ANSYS, and even after the import it still needs a lot of time to mend the import model. For this issue, to predict of the solder joints shape of ball grid array (BGA), the implement programs of three conversion methods of point-line-area method, axisymmetric method and infinitesimal method are given. By comparison, axisymmetric method and infinitesimal method are more suitable for the shape conversion of BGA solder joints.

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Periodical:

Advanced Materials Research (Volumes 706-708)

Pages:

1693-1696

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.706-708.1693

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Online since:

June 2013

Authors:

Hua Bin Zhao, De Jian Zhou

Keywords:

Axisymmetric Method, BGA Solder Joints, Infinitesimal Method, Point-Line-Area Method

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References

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