The Micro-Structure and Wear Behavior of the SiCp/Cu Composites before and after Chemical Plating

Abstract:

In order to improve the interface wettability between the SiCp and Cu materials, the chemical plating and hot pressing sintering technique were utilized to prepare the SiCp/Cu composites. The morphology of the SiC powder before and after chemical plating was studied and the micro-structure of hot-pressed sintered SiCp/Cu composites was investigated in details. The results showed that the finer SiC powder could improve the wear resistance ability of the SiCp/Cu composites obviously. The worn rate reduced with the size of the SiC powder increasing under the same load.

• Periodical: Advanced Materials Research (Volumes 706-708)
• Pages: 344-348
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.706-708.344
• Online since: June 2013
• Authors: Ming Hu, Yun Long Zhang, Jing Gao, You Jin Liu
• Keywords: Chemical Plating, Electronic Packaging Material, SiC Particles, Wear Mechanism

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