The Effect of SiC Content on the Microstructure and Thermal Conductivity Properties of SiCp/Cu Composites

Yun Long Zhang; Ming Hu; You Jin Liu; Jing Gao

doi:10.4028/www.scientific.net/AMR.706-708.331

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 706-708The Effect of SiC Content on the Microstructure...

The Effect of SiC Content on the Microstructure and Thermal Conductivity Properties of SiC_p/Cu Composites

Abstract:

in order to resolve the weaker wettability between the copper and SiC particles and analyze the micro-structure and thermal conductivity properties of the SiCp/Cu composites, the chemical plating technology and pressure-less sintering technique were utilized to fabricate SiCp/Cu composites. The results proved that SiC powders were more homogeneous in the SiCp/Cu composites and interfaces were clear. The coefficients of linear expansion of SiCp/Cu composites were nonlinear increased along with the measuring temperature increasing. When SiC content was constant, the coefficients of thermal expansion (CTE) and thermal conductivity (TCT) of the SiCp/Cu composites would reduce as the content of the SiC powder became higher.

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Periodical:

Advanced Materials Research (Volumes 706-708)

Pages:

331-335

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.706-708.331

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Online since:

June 2013

Authors:

Yun Long Zhang, Ming Hu, You Jin Liu, Jing Gao

Keywords:

Electroless Plating, Electronic Packaging, SiC/Cu Composites, Thermal Conductivity (TC)

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References

[1] Y. F. Lee, S. L. Lee，C. L. Chuang. Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp Composites[J]. Powder Metallurgy, 1999, 42(2):147-152

DOI: 10.1179/003258999665495

Google Scholar

[2] Kuen-Ming Shu, G.C. Tu. The Microstruture and Thermal Expansion Characteristics of Cu/SiCp Composites[J]. Materials Science and Engineering, 2003, A349: 236-247

DOI: 10.1016/s0921-5093(02)00788-8

Google Scholar

[3] He Wanbao, Zhang Baolin, Zhuang Hanrui, et al. Preparation and sintering of Ni-coated Si3N4 composite powders, Ceram. Int. 31 (2005) 811–815.

DOI: 10.1016/j.ceramint.2004.09.008

Google Scholar

[4] Zhu Dezhi,et al. Fabrication and properties of SiC/Cu composites for electronic packaging[C]. 6th International Conference on Electronic Packaging Technology. Shenzhen, 2005: 191-194

DOI: 10.1109/icept.2005.1564679

Google Scholar

[5] Laima Luo, Jia Yu, Juan Luo, et al. Preparation and characterization of Ni-coated Cr3C2 powder by room temperature ultrasonic-assisted electroless plating [J]. Ceramics International, 2010, Vol.36, (6):1989-1992

DOI: 10.1016/j.ceramint.2010.03.003

Google Scholar

[6] Hui Wang, Jianfeng Jia, Hongzhang Song, et al. The preparation of Cu-coated Al2O3 composite powders by electroless plating[J].Ceramics International, 2011,Vol.37,(7), : 2181-2184

DOI: 10.1016/j.ceramint.2011.03.013

Google Scholar