Preparation and Characterization of Self-Healing Microcapsules Containing Two-Component

Xiao Mei Tong; Chang Fu Li

doi:10.4028/www.scientific.net/AMR.734-737.2176

Paper Titles

Copolymerization of Carbon Dioxide and Propylene Oxide Catalyzed by Salen Complexes
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Photocatalytic Decomposition of Methylene Blue with Lanthanum Doping TiO₂ under Visible Light Irradiation
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Physicochemical Characterization of the Magnetic Fe₃O₄/MO-Intercalated-Layered Double Hydroxide Composite
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Preparation and Characterization of Poly(Vinylidene Fluoride) Hollow Fiber Membranes via Modified Thermally Induced Phase Separation Process
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Preparation and Characterization of Self-Healing Microcapsules Containing Two-Component
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Preparation and Characterization of the C₂H₅COOH-Graphite Intercalation Compound
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Preparation of PVB/ β-CD/Silica Nanofibers Using Electrospinning Techniques
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Preparing and Applying of Flame Retardant Microcapsules Containing Magnesium Hydroxide
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Research Progress on Surface Coating of Magnesium and its Alloys as Biomedical Materials
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Preparation and Characterization of Self-Healing Microcapsules Containing Two-Component

Abstract:

Two component self-healing microcapsules were prepared by in situ polymerization with poly (melamine-urea-formaldehyde) as wall, epoxy resin and latent curing agent sebacate hydrazide as core. The ratio of two core material and the reaction process were studied. The size and distribution of particle, surface morphology, structure, thermal properties and content of core were measured and characterized by using particle size analyzer（PSA）, optical microscopy (OM), infrared spectroscopy (FTIR), differential scanning calorimetry (DSC), thermal gravimetric analysis (TGA). The results showed that the microcapsules have smooth and compact surfaces, and have spherical profiles. The average diameter of microcapsules is 30μm and core content of microcapsules is 70%. The heat resistance and solvent resistance of microcapsule are better. The curing temperature is 190°Cand the healing efficiency can be improved.