Influence of Ti Layer on the Structure and Properties of Al/Cu Thin Film

An Na Yue; Kun Peng; Ling Ping Zhou; Jia Jun Zhu; De Yi Li

doi:10.4028/www.scientific.net/AMR.750-752.1879

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 750-752Influence of Ti Layer on the Structure and...

Influence of Ti Layer on the Structure and Properties of Al/Cu Thin Film

Abstract:

Titanium and aluminum films were deposited on oxygen-free copper substrates by electron beam evaporation method to obtain Al/Cu and Al/Ti/Cu layer composites. Evolution of microstructure and properties of Al/Cu and Al/Ti/Cu thin film during heat treatment processes were investigated by XRD, SEM and electrical properties analysis. The introduce of Ti layer can prevent the formation of Cu-Al intermetallic compounds, and has no obvious influence on the electrical resistivity of Al/Cu thin film, which can be used as a pad in microelectronic package and devices.